Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/09/2006
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Application #:
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09469709
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Filing Dt:
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12/21/1999
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Inventors:
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SHIJIAN LI, FRED C. REDEKER, JOHN WHITE, RAMIN EMAMI
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Title:
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HIGH THROUGH-PUT CU CMP WITH SIGNIFICANTLY REDUCED EROSION
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2881 SCOTT BLVD., M/S 2061 |
| SANTA CLARA, CALIFORNIA 95051 |
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| APPLIED MATERIALS, INC. |
| ROBERT W. MULCAHY |
| PATENT COUNSEL, MS/2061 |
| P.O. BOX 450A |
| SANTA CLARA, CA 95052 |
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