Patent Assignment Abstract of Title
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Total Assignments:
4
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Patent #:
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Issue Dt:
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05/16/2006
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Application #:
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09632910
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Filing Dt:
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08/04/2000
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Inventors:
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Kohei Tatsumi, Kenji Shimokawa, Eiji Hashino
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Title:
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METHOD FOR FABRICATING A SEMICONDUCTOR DEVICES PROVIDED WITH LOW MELTING POINT METAL BUMPS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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4-14-1, SOTOKANDA |
CHIYODA-KU |
TOKYO, JAPAN 101-0021 |
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JOHN J. KELLY, JR. |
KENYON & KENYON LLP |
ONE BROADWAY |
NEW YORK, NEW YORK 10004 |
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Assignment:
2
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7-16-3, GINZA |
CHUO-KU |
TOKYO, JAPAN 104-0061 |
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PATRICK J BIRDE |
1 BROADWAY |
KENYON & KENYON LLP |
NEW YORK, NY 10004 |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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2-5-5, SHIMODERA |
NANIWA-KU, OSAKA-SHI |
TOKYO, JAPAN |
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PATRICK J BIRDE |
1 BROADWAY |
KENYON & KENYON LLP |
NEW YORK, NY 10004 |
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Assignment:
4
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CORRECTIVE ASSIGNMENT TO CORRECT THE RECEVING PARTY CITY FIELD FROM TOKYO TO OSAKA. PREVIOUSLY RECORDED ON REEL 037769 FRAME 0919. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT.
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2-5-5, SHIMODERA |
NANIWA-KU, OSAKA-SHI |
OSAKA, JAPAN |
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PATRICK J BIRDE |
1 BROADWAY |
KENYON & KENYON LLP |
NEW YORK, NY 10004 |
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