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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
05/30/2006
Application #:
10225815
Filing Dt:
08/21/2002
Publication #:
Pub Dt:
02/26/2004
Inventors:
Hubert J. Cook, Janet W. Rivett, Gautam P. Shah, Kelly R. Ahlgren, Richard M. Dayrit
Title:
HIGH MODULUS, TEMPERATURE-RESISTANT FILM FOR FORM FILL AND SEAL PACKAGING
Assignment: 1
Reel/Frame:
013461/0503Recorded: 10/29/2002Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
10/08/2002
Exec Dt:
09/30/2002
Exec Dt:
09/30/2002
Exec Dt:
09/30/2002
Exec Dt:
10/10/2002
Assignee:
P.O. BOX 464
100 ROGERS BRIDGE ROAD, BUILDING A
DUNCAN, SOUTH CAROLINA 29334-0464
Correspondent:
SEALED AIR CORPORATION
RUPERT B. HURLEY JR.
PO BOX 464
DUNCAN, SC 29334-0464

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