Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/30/2006
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Application #:
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10811857
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Filing Dt:
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03/30/2004
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Publication #:
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Pub Dt:
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10/13/2005
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Inventors:
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Kwang Won Koh, Song Woon Kim, Sang Bae Park
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Title:
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LEADLESS SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 26, CHIN 3RD RD., NANTZE EXPORT |
| PROCESSING ZONE |
| KAOHSIUNG, TAIWAN R.O.C. |
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| LOWE HAUPTMAN GILMAN & BERNER |
| BENJAMIN J. HAUPTMAN |
| 1700 DIAGONAL ROAD, SUITE 300 |
| ALEXANDRIA, VA 22314 |
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