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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
7054707
Issue Dt:
05/30/2006
Application #:
11011766
Filing Dt:
12/15/2004
Publication #:
20050165505
Pub Dt:
07/28/2005
Inventors:
Yuji Moriya, Tomise Koyama, Hiroshi Nakamura, Manabu Okamoto, Kenichi Hayashi et al
Title:
ELECTRONIC COMPONENT MOUNTING SYSTEM AND ELECTRONIC COMPONENT MOUNTING METHOD
Assignment: 1
Reel/Frame:
016433/0341Recorded: 04/05/2005Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
MORIYA, YUJI
Exec Dt:
03/14/2005
KOYAMA, TOMISE
Exec Dt:
03/14/2005
NAKAMURA, HIROSHI
Exec Dt:
03/15/2005
OKAMOTO, MANABU
Exec Dt:
03/14/2005
HAYASHI, KENICHI
Exec Dt:
03/14/2005
AZUMA, TOSHIO
Exec Dt:
03/15/2005
Assignee:
HITACHI HIGH-TECH INSTRUMENTS CO., LTD.
1-1-1, SAKATA, OIZUMI-MACHI
GUNMA 370-0596, JAPAN
Correspondent:
BARRY E. BRETSCHNEIDER
MORRISON & FOERSTER LLP
1650 TYSONS BOULEVARD, SUITE 300
MCLEAN, VIRGINIA 22102

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