Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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06/20/2006
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Application #:
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10842756
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Filing Dt:
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05/11/2004
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Inventors:
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Abu K. Eghan, Richard C. Li, Xin X. Wu
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Title:
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SEMICONDUCTOR DIE WITH HIGH DENSITY OFFSET-INLINE BOND ARRANGEMENT
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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2100 LOGIC DRIVE |
SAN JOSE, CALIFORNIA 95124 |
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XILINX, INC. |
JUSTIN LIU |
2100 LOGIC DRIVE |
SAN JOSE, CA 95124 |
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