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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
06/27/2006
Application #:
10311692
Filing Dt:
07/22/2003
Publication #:
Pub Dt:
05/27/2004
Inventors:
Noriyo Kimura, Tomoaki Aoki, Kenji Kamio, Masaki Endou
Title:
Photosensitive resin composition, photosensitive element employing it, resist pattern forming method, and printed wiring fabrication method
Assignment: 1
Reel/Frame:
014400/0889Recorded: 07/22/2003Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
01/14/2003
Exec Dt:
01/14/2003
Exec Dt:
01/14/2003
Exec Dt:
01/14/2003
Assignee:
1-1, NISHI-SHINJUKU 2-CHOME
SHINJUKU-KU, TOKYO 163-0449, JAPAN
Correspondent:
GRIFFIN & SZIPL, P.C.
JOERG-UWE SZIPL
2300 NINTH STREET, SOUTH - SUITE PH-1
ARLINGTON, VA 22204-2320

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