Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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08/08/2006
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Application #:
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08680067
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Filing Dt:
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07/15/1996
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Inventors:
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WAYNE J. SCHMIDT, ROBERT W. BERNER, DANIEL J. WOODRUFF
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Title:
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PLATING SYSTEM FOR SEMICONDUCTOR MATERIALS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| P.O. BOX 7010 |
| KALISPELL, MONTANA 59904 |
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| WELLS, ST. JOHN, ROBERTS, GREGORY & |
| MATKIN P.S. |
| RANDY A. GREGORY |
| 601 W. FIRST AVE., SUITE 1300 |
| SPOKANE, WA 99204-0317 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 3050 BOWERS AVENUE |
| SANTA CLARA, CALIFORNIA 95054 |
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| PATTERSON & SHERIDAN, L.L.P. |
| 3040 POST OAK BLVD., SUITE 1500 |
| HOUSTON, TX 77056-6582 |
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