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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
08/08/2006
Application #:
10726377
Filing Dt:
12/03/2003
Publication #:
Pub Dt:
06/09/2005
Inventors:
Richard C. Chu, Michael J. Ellsworth JR., Roger R. Schmidt, Robert E. Simons et al
Title:
COOLING SYSTEM AND METHOD EMPLOYING AT LEAST TWO MODULAR COOLING UNITS FOR ENSURING COOLING OF MULTIPLE ELECTRONICS SUBSYSTEMS
Assignment: 1
Reel/Frame:
014768/0796Recorded: 12/03/2003Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
11/19/2003
Exec Dt:
11/14/2003
Exec Dt:
12/01/2003
Exec Dt:
11/14/2003
Exec Dt:
11/14/2003
Assignee:
NEW ORCHARD ROAD
ARMONK, NEW YORK 10504
Correspondent:
IBM CORPORATION
ANDREW J. WOJNICKI
2445 SOUTH ROAD
POUGHKEEPSIE, NY 12601-5400
Assignment: 2
Reel/Frame:
035201/0479Recorded: 03/13/2015Pages: 40
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
03/31/2014
Assignee:
2029 STIERLIN COURT
MOUNTAIN VIEW, CALIFORNIA 94043
Correspondent:
SCHWEGMAN LUNDBERG & WOESSNER, P.A.
PO BOX 2938
MINNEAPOLIS, MN 55402-0938

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