Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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08/15/2006
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Application #:
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10980671
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Filing Dt:
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11/02/2004
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Publication #:
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Pub Dt:
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03/24/2005
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Inventors:
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Shiann-Tsong Tsai, Yu-Ming Hsu, Wen-Lung Wu, Kuen-Huang Chen, Wen-Sheng Su et al
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Title:
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MULTI-CHIP SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF
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Assignment:
1
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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| NO.2 LI-HSIN ROAD 3, SCIENCE BASED INDUSTRIAL PARK |
| HSINCHU, TAIWAN |
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| HORIZON IP PTE. LTD. |
| 7500A BEACH ROAD, #04-306/308 |
| THE PLAZA |
| SINGAPORE, 199591 SINGAPORE |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 22 ANG MO KIO INDUSTRIAL PARK 2 |
| SINGAPORE, SINGAPORE 569506 |
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| HORIZON IP PTE. LTD. |
| 7500A BEACH ROAD, #04-306/308 |
| THE PLAZA |
| SINGAPORE, 199591 SINGAPORE |
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