Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/29/2006
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Application #:
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10052989
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Filing Dt:
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11/09/2001
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Publication #:
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Pub Dt:
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01/30/2003
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Inventors:
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Han-Kun Hsieh, Shing-Ru Wang, I-Chung Tung
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Title:
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FORMATION OF ELECTROPLATE SOLDER ON AN ORGANIC CIRCUIT BOARD FOR FLIP CHIP JOINTS AND BOARD TO BOARD SOLDER JOINTS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 6, LI-HSIN ROAD, SCIENCE-BASED INDUSTRIAL PARK |
| HSINCHU, TAIWAN ROC |
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| RAYMOND SUN |
| 12420 WOODHALL WAY |
| TUSTIN, CA 92782 |
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