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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
09/19/2006
Application #:
11014572
Filing Dt:
12/16/2004
Publication #:
Pub Dt:
06/23/2005
Inventor:
Motohiko Fukazawa
Title:
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE, CIRCUIT SUBSTRATE AND ELECTRONIC EQUIPMENT
Assignment: 1
Reel/Frame:
016104/0089Recorded: 12/16/2004Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
12/07/2004
Assignee:
4-1 NISHI-SHINJUKU 2-CHOME
SHINJUKU-KU, TOKYO, JAPAN 163-0811
Correspondent:
HARNESS, DICKEY & PIERCE, P.L.C.
G. GREGORY SCHIVLEY
P.O. BOX 828
BLOOMFIELD HILLS, MI 48303
Assignment: 2
Reel/Frame:
028153/0654Recorded: 05/03/2012Pages: 27
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
12/06/2011
Assignee:
416 MAETAN 3-DONG
YEONGTONG-GU
SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF 443-772
Correspondent:
MICHELE P. MCMAHAN
4140 PARKLAKE AVENUE
RALEIGH, NC 27612

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