Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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10/24/2006
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Application #:
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11035258
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Filing Dt:
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01/13/2005
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Publication #:
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Pub Dt:
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07/13/2006
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Inventors:
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Hongy Lin, Yun Wang
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Title:
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HEATER FOR WAFER PROCESSING AND METHODS OF OPERATING AND MANUFACTURING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 12001 LACKLAND ROAD |
| ST. LOUIS, MISSOURI 63146 |
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| KELLY K. BURRIS |
| HARNESS, DICKEY & PIERCE, P.L.C. |
| 770 BONHOMME AVENUE |
| SUITE 400 |
| ST. LOUIS, MO 63105 |
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Assignment:
2
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PATENT SECURITY AGREEMENT (SHORT FORM)
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| 111 WEST MONROE STREET, 17TH FLOOR |
| CHICAGO, ILLINOIS 60603 |
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| JUSTINE LU/WHITE & CASE LLP |
| 555 SOUTH FLOWER STREET, 2700 |
| LOS ANGELES, CA 90071 |
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