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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
11/14/2006
Application #:
10499365
Filing Dt:
06/18/2004
Publication #:
Pub Dt:
01/20/2005
Inventor:
Rui De Oliveira
Title:
METHOD FOR MAKING A MULTILAYER MODULE WITH HIGH-DENSITY PRINTED CIRCUITS
Assignment: 1
Reel/Frame:
015816/0808Recorded: 06/18/2004Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
05/19/2003
Assignee:
CH-1211, GENEVE 23, SWITZERLAND
Correspondent:
STITES & HARBISON PLLC
MARVIN PETRY
1199 NORTH FAIRFAX ST.
SUITE 900
ALEXANDRIA, VA 22314-1437

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