Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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12/12/2006
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Application #:
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10382591
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Filing Dt:
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03/07/2003
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Publication #:
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Pub Dt:
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01/22/2004
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Inventors:
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Pyoung Wan Kim, Sang Hyeop Lee, Chang Cheol Lee, Gun Ah Lee
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Title:
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METHOD FOR JOINING LEAD FRAMES IN A PACKAGE ASSEMBLY, METHOD FOR FORMING A CHIP STACK PACKAGE, AND A CHIP STACK PACKAGE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 416, MAETAN-DONG, PALDAL-GU, SUWON-CITY |
| KYUNGKI-DO, KOREA, REPUBLIC OF |
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| HARNESS, DICKEY & PIERCE, P.L.C. |
| JOHN A. CASTELLANO |
| P.O. BOX 8910 |
| RESTON, VA 20195 |
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