Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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12/19/2006
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Application #:
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11026192
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Filing Dt:
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12/29/2004
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Publication #:
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Pub Dt:
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07/07/2005
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Inventors:
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Georg Stoeppelmann, Ornulf Rexin, Eduard Schmid, Ralph Kettl, Manfred Hewel
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Title:
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USE OF THERMOPLASTIC POLYAMIDE MOULDING COMPOSITIONS WITH REDUCED FORMATION OF SOLID DEPOSITS AND/OR COVERINGS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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REICHENAUERSTRASSE |
CH-7013 DOMAT/EMS, SWITZERLAND |
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J.C. PATENTS |
JAIWEI HUANG |
4 VENTURE, SUITE 250 |
IRVINE, CA 92618 |
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Assignment:
2
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RECORD TO CORRECT THE FIRST INVENTOR'S NAME ON AN ASSIGNMENT PREVIOUSLY RECORDED ON REAL 015927 AND FRAME 0216.
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REICHENAUERSTRASSE, CH-7013 |
DOMAT/EMS, SWITZERLAND |
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J.C. PATENTS |
4 VENTURE, SUITE 250 |
IRVINE, CA 92618 |
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