Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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12/19/2006
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Application #:
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10791896
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Filing Dt:
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03/04/2004
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Publication #:
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Pub Dt:
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09/09/2004
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Inventors:
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Su Tao, Shih Chang Lee
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Title:
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SEMICONDUCTOR CHIP PACKAGE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 26, CHIN 3RD RD., NANTZE EXPORT PROCESSING ZONE |
| KOAHSIUNG, TAIWAN R.O.C. |
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| LOWE HAUPTMAN GILMAN & BERNER |
| BENJAMIN J. HAUPTMAN |
| 1700 DIAGONAL ROAD, SUITE 300 |
| ALEXANDRIA, VA 22314 |
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Assignment:
2
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CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNEE'S CITY ADDRESS PREVIOUSLY RECORDED AT REEL 015048 FRAME 0232.
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| 26, CHIN 3RD RD., NANTZE EXPORT PROCESSING ZONE |
| KAOHSIUNG, TAIWAN R.O.C. |
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| LOWE HAUPTMAN & BERNER, LLP |
| 1700 DIAGONAL ROAD, SUITE 300 |
| ALEXANDRIA, VA 22314 |
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