Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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01/02/2007
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Application #:
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10861149
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Filing Dt:
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06/04/2004
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Publication #:
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Pub Dt:
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12/08/2005
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Inventors:
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Hway Chi Lin, Yi-Lung Cheng, Chao-Hsiung Wang
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Title:
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NOVEL DEVICE STRUCTURE HAVING ENHANCED SURFACE ADHESION AND FAILURE MODE ANALYSIS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO. 8, LI-HSIN ROAD 6 |
SCIENCE-BASED INDUSTRIAL PARK |
HSIN-CHU, TAIWAN 300-77, R.O.C. |
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GEORGE O. SAILE |
28 DAVIS AVENUE |
POUGHKEEPSIE, NY 12603 |
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