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Patent Assignment Abstract of Title
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Total Assignments: 3
Patent #:
Issue Dt:
01/09/2007
Application #:
10485540
Filing Dt:
02/02/2004
Publication #:
Pub Dt:
11/25/2004
Inventors:
Michiaki Tsuneoka, Koji Hashimoto, Masaaki Hayama, Takeo Yasuho
Title:
MODULE COMPONENT
Assignment: 1
Reel/Frame:
015565/0387Recorded: 02/02/2004Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
12/26/2003
Exec Dt:
12/26/2003
Exec Dt:
12/26/2003
Exec Dt:
12/26/2003
Assignee:
1006, OAZA KADOMA
KADOMA-SHI
OSAKA 571-8501, JAPAN
Correspondent:
MCDERMOTT, WILL & EMERY
MICHAEL E. FOGARTY
600 13TH STREET, N.W.
WASHINGTON, DC 20005-3096
Assignment: 2
Reel/Frame:
040174/0455Recorded: 09/29/2016Pages: 4
Conveyance:
CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
10/01/2008
Assignee:
1006, OAZA KADOMA, KADOMA-SHI
OSAKA, JAPAN 571-8501
Correspondent:
PANASONIC CORPORATION
2-1-61, SHIROMI, CHUO-KU
7F OBP PANASONIC TOWER
OSAKA, 540-6207 JAPAN
Assignment: 3
Reel/Frame:
040792/0265Recorded: 12/01/2016Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
10/11/2016
Assignee:
129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO,
SUWON-SI, KOREA, REPUBLIC OF 16677
Correspondent:
SUGHRUE MION, PLLC
2100 PENNSYLVANIA AVE, NW SUITE 800
WASHINGTON, DC 20037-3213

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