Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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01/16/2007
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Application #:
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10250649
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Filing Dt:
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07/07/2003
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Publication #:
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Pub Dt:
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09/30/2004
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Inventors:
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Tetsuro Sato, Noriyuki Nagashima
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Title:
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METHOD FOR PREPARING COPPER FOIL WITH INSULATING LAYER AND COPPER FOIL WITH INSULATING LAYER PREPARED BY THE METHOD, AND PRINTED WIRING BOARD USING THE COPPER FOIL WITH INSULATING LAYER
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 11-1, OSAKI 1-CHOME |
| SHINAGAWA-KU, TOKYO 141-8584, JAPAN |
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| ROTHWELL FIGG ERNST & MANBECK |
| ROBERT B. MURRAY |
| 1425 K STREET, NW |
| SUITE 800 |
| WASHINGTON, DC 20005 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 11-1, OSAKI 1-CHOME |
| SHINAGAWA-KU |
| TOKYO 141-8584, JAPAN |
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| ROTHWELL, FIGG, ERNST ET AL. |
| ROBERT B. MURRAY |
| 1425 K STREET, N.W. |
| SUITE 800 |
| WASHINGTON, D.C. 20005 |
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