Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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02/20/2007
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Application #:
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11004750
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Filing Dt:
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12/03/2004
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Publication #:
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Pub Dt:
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06/09/2005
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Inventor:
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Rakesh Batish
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Title:
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METHOD FOR REDUCING OR ELIMINATING SEMICONDUCTOR DEVICE WIRE SWEEP IN A MULTI-TIER BONDING DEVICE AND A DEVICE PRODUCED BY THE METHOD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| LITTLE FALLS CENTER TWO |
| 2751 CENTERVILLE ROAD, SUITE 3165 |
| WILMINGTON, DELAWARE 19808 |
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| JACQUES L. ETKOWICZ |
| RATNERPRESTIA |
| SUITE 301, ONE WESTLAKES |
| BERWYN, P.O. BOX 980 |
| VALLEY FORGE, PA 19482-0980 |
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Assignment:
2
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MERGER (SEE DOCUMENT FOR DETAILS).
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| 1005 VIRGINIA DRIVE |
| FORT WASHINGTON, PENNSYLVANIA 19034 |
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| CHRISTOPHER M. SPLETZER, SR. |
| 1005 VIRGINIA DRIVE |
| FORT WASHINGTON, PA 19034 |
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