Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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02/27/2007
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Application #:
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10882635
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Filing Dt:
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06/30/2004
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Publication #:
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Pub Dt:
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01/05/2006
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Inventors:
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John Heck, Qing Ma, Eyal Bar-Sadeh
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Title:
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MODULE INTEGRATING MEMS AND PASSIVE COMPONENTS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2200 MISSION COLLEGE BOULEVARD |
| SANTA CLARA, CALIFORNIA 95052 |
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| BLAKELY, SOKOLOFF, TAYLOR & ZAFMAN LLP |
| BRENT E. VECCHIA |
| 12400 WILSHIRE BOULEVARD, 7TH FLOOR |
| LOS ANGELES, CALIFORNIA 90025 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 3600 BRIDGE PARKWAY |
| SUITE 102 |
| REDWOOD CITY, CALIFORNIA 94065 |
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| WILSON SONSINI GOODRICH & ROSATI |
| 650 PAGE MILL ROAD |
| PALO ALTO, CA 94304 |
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