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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
02/27/2007
Application #:
10483175
Filing Dt:
01/09/2004
Publication #:
Pub Dt:
11/04/2004
Inventors:
Osamu Shiono, Takao Ishikawa, Takashi Namekawa, Yasutaka Suzuki, Takashi Naito et al
Title:
WIRING GLASS SUBSTRATE FOR CONNECTING A SEMICONDUCTOR CHIP TO A PRINTED WIRING SUBSTRATE AND A SEMICONDUCTOR MODULE HAVING THE WIRING GLASS SUBSTRATE
Assignment: 1
Reel/Frame:
015518/0208Recorded: 01/09/2004Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
12/07/2003
Exec Dt:
12/02/2003
Exec Dt:
11/26/2003
Exec Dt:
12/13/2003
Exec Dt:
11/26/2003
Exec Dt:
11/26/2003
Exec Dt:
12/03/2003
Exec Dt:
12/05/2003
Exec Dt:
12/15/2003
Exec Dt:
11/26/2003
Exec Dt:
10/12/2003
Exec Dt:
12/09/2003
Assignee:
6, KANDA SURUGADAI 4-CHOME
CHIYODA-KU, TOKYO 101-8010, JAPAN
Correspondent:
DICKSTEIN SHAPIRO & OSHINSKY LLP
MARK J. THRONSON
2101 L STREET NW
WASHINGTON, DC 20037-1526
Assignment: 2
Reel/Frame:
018118/0680Recorded: 07/24/2006Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
06/27/2006
Assignee:
MARUNOUCHI BLDG.
4-1, MARUNOUCHI 2-CHOME, CHIYODA-KU
TOKYO, JAPAN
Correspondent:
DICKSTEIN SHAPIRO LLP
MARK J. THRONSON
1825 EYE STREET, N.W.
WASHINGTON, DC 20006-5403

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