Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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02/27/2007
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Application #:
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10483175
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Filing Dt:
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01/09/2004
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Publication #:
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Pub Dt:
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11/04/2004
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Inventors:
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Osamu Shiono, Takao Ishikawa, Takashi Namekawa, Yasutaka Suzuki, Takashi Naito et al
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Title:
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WIRING GLASS SUBSTRATE FOR CONNECTING A SEMICONDUCTOR CHIP TO A PRINTED WIRING SUBSTRATE AND A SEMICONDUCTOR MODULE HAVING THE WIRING GLASS SUBSTRATE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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6, KANDA SURUGADAI 4-CHOME |
CHIYODA-KU, TOKYO 101-8010, JAPAN |
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DICKSTEIN SHAPIRO & OSHINSKY LLP |
MARK J. THRONSON |
2101 L STREET NW |
WASHINGTON, DC 20037-1526 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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MARUNOUCHI BLDG. |
4-1, MARUNOUCHI 2-CHOME, CHIYODA-KU |
TOKYO, JAPAN |
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DICKSTEIN SHAPIRO LLP |
MARK J. THRONSON |
1825 EYE STREET, N.W. |
WASHINGTON, DC 20006-5403 |
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