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Patent Assignment Abstract of Title

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Total Assignments: 1

Patent #:	7187078	Issue Dt:	03/06/2007	Application #:	10938594	Filing Dt:	09/13/2004
Publication #:	20060055035	Pub Dt:	03/16/2006
Inventors:	Tzu-Han Lin, Huei-Mei Yu, Chia-Jen Cheng, Chun-Yen Lo, Li-Hsin Tseng, Boe Su, Simon Lu
Title:	BUMP STRUCTURE

Assignment: 1

Reel/Frame:

015803/0492

Recorded: 09/13/2004

Pages: 4

Conveyance:

ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).

Assignors:

LIN, TZU-HAN

Exec Dt:

07/29/2004

YU, HUEI-MEI

Exec Dt:

07/29/2004

CHENG, CHIA-JEN

Exec Dt:

07/29/2004

LO, CHUN-YEN

Exec Dt:

07/28/2004

TSENG,LI-HSIN

Exec Dt:

07/29/2004

SU, BOE

Exec Dt:

07/29/2004

LU,SIMON

Exec Dt:

08/02/2004

Assignee:

TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

NO.8, LI-HSIN RD. 6

SCIENCE-BASED INDUSTRIAL PARK

HSIN-CHU, TAIWAN 300-77

Correspondent:

BIRCH, STEWART ET.AL.

JOE MCKINNEY MUNCY

8110 GATEHOUSE RD

STE 100 E. P.O. BOX 747

FALLS CHURCH, VA 22040-0747

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