Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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03/13/2007
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Application #:
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11029529
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Filing Dt:
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01/04/2005
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Publication #:
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Pub Dt:
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12/29/2005
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Inventors:
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Yen-Chun Chen, Sun-Zen Lin, Chich-Yuan Chang
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Title:
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SEMICONDUCTOR PACKAGE WITH EXPOSED HEAT SINK AND THE HEAT SINK THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 123, SEC. 3 DA FONG ROAD, TANTZU |
| TAICHUNG HSIEN, TAIWAN ROC |
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| PETER F. CORLESS |
| EDWARDS & ANGELL, LLP |
| P.O. BOX 55874 |
| BOSTON, MA 02205 |
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