Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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04/03/2007
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Application #:
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10755983
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Filing Dt:
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01/13/2004
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Publication #:
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Pub Dt:
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07/22/2004
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Inventors:
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Nobuaki Takahashi, Yuji Akimoto, Mikio Oda, Hikaru Kouta
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Title:
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Method for forming contact bumps for circuit board
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1753 SHIMONUMABE |
| NAKAHARA-KU, KAWASAKI |
| KANAGAWA 211-8668, JAPAN |
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| 7-1, SHIBA 5-CHOME |
| MINATO-KU, TOKYO, JAPAN |
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| HAYES SOLOWAY P.C. |
| NORMAN P. SOLOWAY |
| 130 W. CUSHING STREET |
| TUCSON, AZ 85701 |
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Assignment:
2
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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| 1753 SHIMONUMABE, NAKAHARA-KU, |
| KAWASAKI-SHI, KANAGAWA, JAPAN 211-8668 |
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| SUGHRUE MION, PLLC |
| 2100 PENNSYLVANIA AVENUE, N.W. |
| SUITE 800 |
| WASHINGTON, DC 20037 |
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