Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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04/10/2007
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Application #:
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10933423
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Filing Dt:
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09/03/2004
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Publication #:
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Pub Dt:
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03/10/2005
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Inventors:
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Masazumi Matsuura, Hiroshi Horibe, Susumu Matsumoto, Tsuyoshi Hamatani
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Title:
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SEMICONDUCTOR DEVICE, WHICH EMPLOYS AN INTERLAYER INSULATING FILM OF A LOW MECHANICAL STRENGTH AND A HIGHLY RELIABLE METAL PAD, AND A METHOD OF MANUFACTURING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 4-1, MARUNOUCHI 2-CHOME, CHIYODA-KU |
| TOKYO, JAPAN 100-6334 |
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| 1006, OAZA KADOMA, KADOMA-SHI |
| OSAKA, JAPAN 571-8501 |
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| MCDERMOTT WILL & EMERY LLP |
| GENE Z. RUBINSON |
| 600 13TH STREET, N.W. |
| WASHINGTON, D.C. 20005-3096 |
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Assignment:
2
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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| 1006 OAZA KADOMA, KADOMA-SHI |
| OSAKA, JAPAN 571-8501 |
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| KENJI KAMATA |
| 1130 CONNECTICUT AVE., N.W., SUITE 1100 |
| PANASONIC PATENT CENTER |
| WASHINGTON, DC 20036 |
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Assignment:
3
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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| 1753, SHIMONUMABE, NAKAHARU-KU, KAWASAKI-SHI, |
| KANAGAWA, JAPAN 211-8668 |
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| MCDERMOTT WILL & EMERY LLP |
| 600 THIRTEENTH STREET, N.W. |
| WASHINGTON, DC 20005-3096 |
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