Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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04/10/2007
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Application #:
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10851288
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Filing Dt:
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05/21/2004
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Publication #:
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Pub Dt:
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03/17/2005
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Inventors:
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Chin-Te Chen, Chang-Fu Lin
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Title:
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HEAT DISSIPATING STRUCTURE AND SEMICONDUCTOR PACKAGE WITH THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 123, SEC. 3, DA FONG ROAD, TANTZU |
| TAICHUNG HSIEN, TAIWAN R.O.C. |
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| EDWARDS & ANGELL, LLP |
| PETER F. CORLESS |
| P.O. BOX 55874 |
| BOSTON, MA 02205 |
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