Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
2
|
|
Patent #:
|
|
Issue Dt:
|
04/17/2007
|
Application #:
|
10740239
|
Filing Dt:
|
12/17/2003
|
|
Inventors:
|
Gregory J. Smith, John W. Oglesbee
|
|
Title:
|
FLIP CHIP MOUNTED TO THERMAL SENSING ELEMENT THROUGH THE BACK SIDE OF THE CHIP
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| 1303 E. ALGONQUIN ROAD |
| SCHAUMBURG, ILLINOIS 60196-1079 |
|
|
|
|
| MOTOROLA SOLUTIONS, INC. |
| 1303 E. ALGONQUIN ROAD |
| IL02-SH5 |
| SCHAUMBURG, IL 60196 |
|
|
|
Assignment:
2
|
|
|
|
|
|
|
CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| 1303 E. ALGONQUIN ROAD |
| SCHAUMBURG, ILLINOIS 60196 |
|
|
|
|
| MOTOROLA SOLUTIONS, INC. |
| 1303 E. ALGONQUIN ROAD |
| IL02 - SH5 |
| SCHAUMBURG, IL 60196 |
|
|
Search Results as of:
05/10/2024 06:59 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
