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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
05/08/2007
Application #:
10801952
Filing Dt:
03/16/2004
Publication #:
Pub Dt:
12/02/2004
Inventor:
Ikuya Miyazawa
Title:
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE, CIRCUIT SUBSTRATE AND ELECTRONIC APPARATUS
Assignment: 1
Reel/Frame:
014929/0667Recorded: 08/02/2004Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
07/22/2004
Assignee:
4-1 NISHI-SHINJUKI, 2-CHOME, SHINJUKU-KU
TOKYO, JAPAN
Correspondent:
HARNESS, DICKEY & PIERCE, P.L.C.
G. GREGORY SCHIVLEY
P.O. BOX 828
BLOOMFIELD HILLS, MI 48303
Assignment: 2
Reel/Frame:
028153/0654Recorded: 05/03/2012Pages: 27
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
12/06/2011
Assignee:
416 MAETAN 3-DONG
YEONGTONG-GU
SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF 443-772
Correspondent:
MICHELE P. MCMAHAN
4140 PARKLAKE AVENUE
RALEIGH, NC 27612

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