Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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05/15/2007
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Application #:
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10816576
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Filing Dt:
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03/24/2004
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Inventors:
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Hou Tee Ng, Jun Li, Meyya Meyyappan
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Title:
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METALLIC NANOWIRE INTERCONNECTIONS FOR INTEGRATED CIRCUIT FABRICATION
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| WASHINGTON, DISTRICT OF COLUMBIA 20546 |
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| NASA AMES RESEARCH CENTER |
| JOHN F. SCHIPPER |
| MAIL STOP 202A-4 |
| MOFFETT FIELD, CA 94035-100 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| WASHINGTON, DISTRICT OF COLUMBIA 20546 |
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| NASA AMES RESEARCH CENTER |
| ATTN: PATENT COUNSEL |
| MAIL STOP 202A-4 |
| MOFFET FIELD, CA 94035-1000 |
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