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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
05/15/2007
Application #:
10717591
Filing Dt:
11/21/2003
Publication #:
Pub Dt:
06/17/2004
Inventors:
Masahiro Sunohara, Kei Murayama, Naohiro Mashino, Mitsutoshi Higashi
Title:
ELECTRONIC PARTS PACKAGING STRUCTURE AND METHOD OF MANUFACTURING THE SAME
Assignment: 1
Reel/Frame:
014736/0776Recorded: 11/21/2003Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
11/11/2003
Exec Dt:
11/11/2003
Exec Dt:
11/11/2003
Exec Dt:
11/11/2003
Assignee:
80, OSHIMADA-MACHI, NAGANO-SHI
NAGANO 381-2287, JAPAN
Correspondent:
ARMSTRONG, KRATZ, QUINTOS, HANSON, ET AL
DONALD W. HANSON
1725 K STREET, N.W., SUITE 1000
WASHINGTON, D.C. 20006

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