Patent Assignment Abstract of Title
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Total Assignments:
4
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Patent #:
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Issue Dt:
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05/22/2007
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Application #:
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10988042
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Filing Dt:
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11/12/2004
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Publication #:
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Pub Dt:
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06/16/2005
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Inventors:
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Yoshiyuki Nozawa, Kazuo Kasai, Hiroaki Kouno
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Title:
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METHOD FOR ETCHING OF A SILICON SUBSTRATE AND ETCHING APPARATUS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1-10, FUSO-CHO |
| AMAGASAKI-SHI, HYOGO, 660-0891, JAPAN |
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| JOSEPH R. ROBINSON |
| DARBY & DARBY P.C. |
| ATTY. DKT.: 20110/0201859-US0 |
| P.O. BOX 5257 |
| NEW YORK, NY 10150-5257 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 8-11, HARUMI 1-CHOME |
| CHUO-KU |
| TOKYO, JAPAN 104-6108 |
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| SUGHRUE MION, PLLC |
| 2100 PENNSYLVANIA AVE. NW |
| SUITE 800 |
| WASHINGTON, DC 20037 |
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Assignment:
3
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| KEIDANREN KAIKAN 15F, 1-3-2, OTEMACHI, CHIYODA-KU |
| TOKYO, JAPAN |
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| SUGHRUE MION, PLLC |
| 2100 PENNSYLVANIA AVE. NW |
| SUITE 800 |
| WASHINGTON, DC 20037 |
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Assignment:
4
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| SUMITOMO CORPORATION TAKEBASHI BLDG., 4TH FLOOR, 1-2-2 HITOTSUBASHI, CHIYODA-KU, |
| TOKYO, JAPAN 100-0003 |
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| CPA GLOBAL LIMITED |
| LIBERATION HOUSE |
| CASTLE STREET |
| ST HELIER, JEI IBL JERSEY |
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