Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/29/2007
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Application #:
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10820852
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Filing Dt:
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04/09/2004
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Publication #:
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Pub Dt:
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10/21/2004
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Inventors:
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Kazuhisa Arai, Takashi Mori, Hideyuki Sandoh, Shinichi Namioka
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Title:
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FLIP CHIP BONDER
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 14-3, HIGASHI-KOJIYA 2-CHOME |
| OTA-KU, TOKYO 144-8650, JAPAN |
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| SMITH, GAMBRELL & RUSSELL |
| MICHAEL A. MAKUCH |
| 1850 M STREET, N.W. |
| SUITE 800 |
| WASHINGTON, DC 20036 |
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