Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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05/29/2007
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Application #:
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10848649
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Filing Dt:
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05/18/2004
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Publication #:
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Pub Dt:
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11/24/2005
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Inventor:
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Sung-Jin Kim
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Title:
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SUBSTRATE FOR SOLDER JOINT
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 2, LI-HSIN ROAD, 3, SCIENCE-BASED INDUSTRIAL PARK |
| HSIN-CHU, TAIWAN R.O.C. |
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| ANDERSON KILL & OLICK, P.C. |
| EUGENE LIBERSTEIN |
| 1251 AVENUE OF THE AMERICAS |
| 42ND STREET |
| NEW YORK, NY 10020 |
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Assignment:
2
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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| NO.2 LI-HSIN ROAD 3, SCIENCE BASED INDUSTRIAL PARK |
| HSINCHU, TAIWAN |
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| HORIZON IP PTE. LTD. |
| 7500A BEACH ROAD, #04-306/308 |
| THE PLAZA |
| SINGAPORE, 199591 SINGAPORE |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 22 ANG MO KIO INDUSTRIAL PARK 2 |
| SINGAPORE, SINGAPORE 569506 |
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| HORIZON IP PTE. LTD. |
| 7500A BEACH ROAD, #04-306/308 |
| THE PLAZA |
| SINGAPORE, 199591 SINGAPORE |
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