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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
06/26/2007
Application #:
10928244
Filing Dt:
08/30/2004
Publication #:
Pub Dt:
04/28/2005
Inventors:
Eriko Ajioka, Hitoyoshi Kurata, Hideaki Shimoda, Shigeru Asami
Title:
ELECTRONIC COMPONENT MODULE AND MANUFACTURING METHOD THEREOF
Assignment: 1
Reel/Frame:
016121/0092Recorded: 01/03/2005Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
08/18/2004
Exec Dt:
08/18/2004
Exec Dt:
08/18/2004
Exec Dt:
08/18/2004
Assignee:
1-13-1, NIHONBASHI, CHUO-KU
TOKYO, JAPAN 103-8272
Correspondent:
OBLON, SPIVAK, MCCLELLAND, MAIER
1940 DUKE STREET
ALEXANDRIA, VIRGINIA 22314
Assignment: 2
Reel/Frame:
041650/0932Recorded: 02/07/2017Pages: 47
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
02/01/2017
Assignee:
5775 MOREHOUSE DRIVE
SAN DIEGO, CALIFORNIA 92121
Correspondent:
QUALCOMM INCORPORATED
5775 MOREHOUSE DRIVE
SAN DIEGO, CA 92121

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