Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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07/10/2007
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Application #:
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10876922
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Filing Dt:
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06/25/2004
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Publication #:
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Pub Dt:
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12/29/2005
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Inventors:
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Shu Chuen Ho, Teng Hock Kuah, Yi Lin, Zhi Pan Zhang, Shuai Ge Lee, Chun Yu Li
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Title:
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METHOD AND APPARATUS FOR MOLDING A SEMICONDUCTOR DEVICE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2 YISHUN AVENUE 7, SINGAPORE 768924 |
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| OSTROLENK, FABER, GERB & SOFFEN, LLP |
| 1180 AVENUE OF THE AMERICAS |
| NEW YORK, NEW YORK 10036-8403 |
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