Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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07/10/2007
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Application #:
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10318606
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Filing Dt:
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12/11/2002
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Publication #:
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Pub Dt:
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06/17/2004
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Inventors:
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Larry Clevenger, Timothy Joseph Dalton, Mark Hoinkis, Staffen K. Kaldor, Chih-Chao Yang et al
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Title:
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METHOD FOR DEPOSITING A METAL LAYER ON A SEMICONDUCTOR INTERCONNECT STRUCTURE HAVING A CAPPING LAYER
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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1730 NORTH FIRST STREET |
SAN JOSE, CALIFORNIA 95112 |
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IBM CORPORATION |
IRA DAVID BLECKER |
DEPT. 18G/BLDG. 300-482 |
2070 ROUTE 52 |
HOPEWELL JUNCTION, NY 12533-6531 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NEW ORCHARD ROAD |
ARMONK, NEW YORK 10504 |
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IBM CORPORATION |
IRA D. BLECKER |
2070 ROUTE 52, DEPT. 18G/BLDG. 300-482 |
INTELLECTUAL PROPERTY LAW DEPT. |
HOPEWELL JUNCTION, NY 12533-6531 |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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ST. MARTIN-STR. 53 |
81541 MUNICH, GERMANY |
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SIEMENS CORPORATION |
ELSA KELLER |
186 WOOD AVENUE SOUTH |
INTELLECTUAL PROP. DEPT. |
ISELIN, NJ 08830 |
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