Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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07/10/2007
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Application #:
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11274397
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Filing Dt:
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11/14/2005
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Publication #:
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Pub Dt:
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08/24/2006
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Inventor:
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Shih-Ping Hsu
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Title:
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SUBSTRATE ASSEMBLY WITH DIRECT ELECTRICAL CONNECTION AS A SEMICONDUCTOR PACKAGE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 6, LI-HSIN ROAD, SCIENCE-BASED INDUSTRIAL |
| PARK, HSIN-CHU, TAIWAN R.O.C. |
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| JOSEPH A. SAWYER, JR. |
| SAWYER LAW GROUP LLP |
| P.O. BOX 51418 |
| PALO ALTO, CA 94303 |
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