Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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07/31/2007
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Application #:
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11073724
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Filing Dt:
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03/08/2005
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Publication #:
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Pub Dt:
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07/14/2005
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Inventors:
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Yasufumi Shirakawa, Masaki Taniguchi, Hideo Fukuda, Yuzo Shimizu, Shinya Esaki
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Title:
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INTEGRATED CIRCUIT DEVICE PACKAGING STRUCTURE AND PACKAGING METHOD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 3945 FREEDOM CIRCLE |
| SUITE 900 |
| SANTA CLARA, CALIFORNIA 95054 |
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| CLARK & BRODY |
| 1700 DIAGONAL ROAD |
| SUITE 510 |
| ALEXANDRIA, VA 22314 |
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