Patent Assignment Abstract of Title
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Total Assignments:
4
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Patent #:
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Issue Dt:
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07/31/2007
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Application #:
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10908277
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Filing Dt:
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05/05/2005
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Publication #:
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Pub Dt:
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11/09/2006
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Inventors:
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Benjamin V. Fasano, Brian R. Sundlof
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Title:
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METHOD AND APPARATUS FOR FORMING STACKED DIE AND SUBSTRATE STRUCTURES FOR INCREASED PACKING DENSITY
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NEW ORCHARD ROAD |
| ARMONK, NEW YORK 10504 |
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| CANTOR COLBURN LLP |
| 55 GRIFFIN ROAD SOUTH |
| BLOOMFIELD, CT 06002 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| PO. BOX 31119 GRAND PAVILION, HIBISCUS WAY, 802 WEST BAY ROAD |
| GRAND CAYMAN, CAYMAN ISLANDS KY1-1205 |
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| JIANPING ZHANG |
| SEED IP LAW GROUP LLP |
| 701 FIFTH AVENUE, SUITE 5400 |
| SEATTLE, WA 98104 |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 13D-3-3, BUILDING B, FLOOR 13, NO. 28 |
| XINYI ROAD, HAIDIAN DISTRICT |
| BEIJING, CHINA |
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| SEED IP LAW GROUP |
| 701 5TH AVE |
| STE 5400 |
| SEATTLE, WA 98104 |
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Assignment:
4
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 0207, 2/F, BUILDING 4, ZIJIN DIGITAL PARK |
| HAIDIAN DISTRICT |
| BEIJING, CHINA 100190 |
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| SEED IP LAW GROUP LLP |
| 701 5TH AVENUE |
| SUITE 5400 |
| SEATTLE, WA 98104 |
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