Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/07/2007
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Application #:
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10954999
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Filing Dt:
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09/29/2004
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Publication #:
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Pub Dt:
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03/30/2006
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Inventors:
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Daewoong Suh, Saikumar Jayaraman, Stephen E. Lehman JR., Mitesh Patel, Tiffany A. Byrne et al
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Title:
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STRESS-RELIEF LAYERS AND STRESS-COMPENSATION COLLARS WITH LOW-TEMPERATURE SOLDERS FOR BOARD-LEVEL JOINTS, AND PROCESSES OF MAKING SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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2200 MISSION COLLEGE BLVD. |
SANTA CLARA, CALIFORNIA 95052 |
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SCHWEGMAN, LUNDBERG, WOESSNER ET AK |
ANN M. MCCRACKIN |
P.O. BOX 2938 |
MINNEAPOLIS, MN 55402 |
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