Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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08/07/2007
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Application #:
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11014165
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Filing Dt:
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12/17/2004
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Publication #:
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Pub Dt:
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06/23/2005
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Inventors:
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Chien Liu, Meng-Jen Wang, Chi-Hao Chiu, Tai-Yuan Huang, Hsueh-Te Wang
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Title:
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SEMICONDUCTOR PACKAGE WITH A FLIP CHIP ON A SOLDER-RESIST LEADFRAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 26, CHIN 3RD, NANTZE EXPORT |
| PROCESSING ZONE |
| KAOHSIUNG, TAIWAN R.O.C. |
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| TROXELL LAW OFFICE PLLC |
| 5205 LEESBURG PIKE |
| SUITE 1404 |
| FALLS CHURCH, VIRGINIA 22041-3401 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 26, CHIN 3RD RD., NANTZE EXPORT |
| PROCESSING ZONE, KAOHSIUNG, TAIWAN R.O.C. |
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| TROXELL LAW OFFICE PLLC |
| 5205 LEESBURG PIKE, SUITE 1404 |
| FALLS CHURCH, VIRGINIA 22041 |
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