Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/14/2007
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Application #:
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11420822
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Filing Dt:
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05/30/2006
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Publication #:
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Pub Dt:
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09/14/2006
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Inventors:
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Hsin-Hui Lee, Chao-Yuan Su
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Title:
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UNDERFILLING EFFICIENCY BY MODIFYING THE SUBSTRATE DESIGN OF FLIP CHIPS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 8, LI-HSIN RD. 6 |
| SCIENCE-BASED INDUSTRIAL PARK |
| HSIN-CHU, TAIWAN 300-77, R.O.C. |
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| DANIEL R. MCCLURE |
| 100 GALLERIA PARKWAY |
| SUITE 1750 |
| ATLANTA, GA 30339 |
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