Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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08/28/2007
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Application #:
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11038374
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Filing Dt:
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01/18/2005
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Publication #:
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Pub Dt:
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04/20/2006
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Inventors:
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David M. Craig, Chien-Hua Chen, Charles C. Haluzak, Ronnie J. Yenchik
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Title:
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ASSEMBLY WITH A RING AND BONDING PADS FORMED OF A SAME MATERIAL ON A SUBSTRATE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 20555 SH 249 |
| HOUSTON, TEXAS 77070 |
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| RECORDS MANAGER |
| INTELLECTUAL PROPERTY ADMINISTRATION |
| HEWLETT-PACKARD COMPANY |
| P.O. BOX 272400 |
| FORT COLLINS, COLORADO 80527-2400 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 416 MAETAN-DONG |
| YEONGTONG-GU, SUWON-SI |
| GYEONGGI-DO, KOREA, REPUBLIC OF |
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| ROBERT N. CROUSE |
| MYERS BIGEL SIBLEY & SAJOVEC |
| P.O. BOX 37428 |
| RALEIGH, NC 27627 |
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