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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
09/11/2007
Application #:
10503496
Filing Dt:
08/05/2004
Publication #:
Pub Dt:
06/02/2005
Inventors:
Koji Nitta, Shinji Inazawa, Akihisa Hosoe
Title:
FINE ELECTROFORMING MOLD AND MANUFACTURING METHOD THEREOF
Assignment: 1
Reel/Frame:
016343/0980Recorded: 08/05/2004Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
12/04/2003
Exec Dt:
12/04/2003
Exec Dt:
12/04/2003
Assignee:
5-33, KITAHAMA 4-CHOME CHUO-KU
OSAKA-SHI, OSAKA, JAPAN 541-0041
Correspondent:
MCDERMOTT WILL & EMERY LLP
600 13TH STREET, N.W.
WASHINGTON, D.C. 20005-3096

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