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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
10/02/2007
Application #:
10766212
Filing Dt:
01/29/2004
Publication #:
Pub Dt:
09/23/2004
Inventor:
Masaru Takaishi
Title:
Method for filling a contact hole having a small diameter and a large aspect ratio
Assignment: 1
Reel/Frame:
014944/0227Recorded: 01/29/2004Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
11/26/2003
Assignee:
21, SAIIN MIZOSAKI-CHO, UKYO-KU
KYOTO-SHI, KYOTO 615-8585, JAPAN
Correspondent:
RABIN & BERDO, P.C.
ROBERT H. BERDO, JR.
1101 14TH STREET, N.W., SUITE 500
WASHINGTON, D.C. 20005

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