Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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10/23/2007
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Application #:
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11282967
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Filing Dt:
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11/18/2005
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Publication #:
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Pub Dt:
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05/24/2007
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Inventors:
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Erwin Victor R. Cruz, Elsie Cabahug, Ti Ching Shian, Venkat Iyer
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Title:
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SEMICONDUCTOR DIE PACKAGE USING LEADFRAME AND CLIP AND METHOD OF MANUFACTURING
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 82 RUNNING HILL ROAD |
| MS 35-4E |
| SOUTH PORTLAND, MAINE 04106 |
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| PATRICK R. JEWIK |
| TOWNSEND AND TOWNSEND AND CREW LLP |
| TWO EMBARCADERO CENTER, EIGHTH FLOOR |
| SAN FRANCISCO, CALIFORNIA 94111-3834 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 5005 E. MCDOWELL ROAD, MD A700 |
| PHOENIX, ARIZONA 85008 |
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| SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC |
| 5005 E. MCDOWELL ROAD |
| MD A700 |
| PHOENIX, AZ 85008 |
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