Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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11/13/2007
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Application #:
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11242296
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Filing Dt:
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10/03/2005
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Publication #:
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Pub Dt:
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09/28/2006
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Inventor:
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Yang Zhao
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Title:
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CHIP-SCALE PACKAGE FOR INTEGRATED CIRCUITS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 800 TURNPIKE STREET, SUITE 202 |
| NORTH ANDOVER, MASSACHUSETTS 01845 |
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| STANLEY M. SCHURGIN |
| WEINGARTEN, SCHURGIN, GAGNEBIN ET AL. |
| TEN POST OFFICE SQUARE |
| BOSTON, MASSACHUSETTS 02109 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| ROOM 501, BUILDING 4, FINANCIAL CENTER, NO.158 |
| WEST THIRD ROAD, TIANJIN AIRPORT ECONOMIC AREA |
| TIANJIN, CHINA |
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| ECOTECH LAW GROUP, P.C. |
| THE HEARST BUILDING, 5 THIRD STREET |
| SUITE 700 |
| SAN FRANCISCO, CA 94103 |
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