Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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12/11/2007
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Application #:
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10175141
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Filing Dt:
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06/19/2002
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Publication #:
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Pub Dt:
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01/30/2003
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Inventors:
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Kazuhiko Ohashi, Koji Yoshida, Osamu Yokomizo
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Title:
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INTERGRATED CIRCUIT CHIP BONDING SHEET AND INTEGRATED CIRCUIT PACKAGE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 42-5, 1-CHOME, AKAZUTSUMI, SETAGAUA-LI |
| TOKYO, JAPAN 156 |
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| W.L. GORE & ASSOCIATES, INC. |
| ALLAN WHEATCRAFT |
| 551 PAPER MILL ROAD |
| NEWARK, DE 19711 |
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